New SMT Line Achieves Significantly Higher Output with Reduced Space Requirements

Kelsterbach, February 5, 2025 – The demand for higher output volumes is rising, along with the complexity of component geometries – all while manufacturing space remains limited. This situation posed a major challenge for FEIG ELECTRONIC’s electronics production, as the existing SMT line became a bottleneck for growing requirements. By implementing a new SMT line based on the NXTR series placement systems and additional components from FUJI EUROPE CORPORATION GmbH ( www.fuji-euro.de), the company has transformed its SMT production at its Weilburg site, making it future-ready.

FEIG ELECTRONIC GmbH develops and manufactures its own electronic products – from populated PCBs to complete systems – in the product areas of gate and barrier control systems, RFID and barcode systems, and payment terminals. Demand and output continue to increase, but manufacturing space cannot expand accordingly. In addition, the complexity of component geometries is growing in terms of size, shape, and special designs.

“Our previous placement systems required increasing maintenance and could no longer meet the growing demands for efficiency and flexibility. In December 2024, we installed a new SMT placement line with FUJI machines and experienced noticeable positive effects in a very short time. We were able to significantly increase output – while even saving space,” explains Markus Mink, Operations Manager at FEIG ELECTRONIC.

Higher and Automated Placement Performance in a Smaller Space

The new SMT line at FEIG ELECTRONIC consists of six NXTR S placement systems with an automatic tray changer, Smart Nozzle Cleaner, and a NEXIM software package that integrates HERMES and IPC-CFX interfaces for seamless communication.

The increasing number of PCB layers and the higher demands on placement performance required an extension of the reflow soldering system. Stefan Juchem, Regional Sales Manager at FUJI EUROPE CORPORATION, explains: “The additional space required was ideally offset by the compact design of the NXTR modules. These systems are specifically designed to provide very high placement performance while requiring minimal space. This is particularly beneficial in constrained manufacturing environments in brownfield settings.”

FEIG ELECTRONIC is also successfully managing the increasing complexity of components with the NXTR systems. Since the placement heads and nozzles cover a wide range of components, more complex shapes can be placed automatically. As a result, the number of manually placed components in the THT process is reduced.

Reduced Downtime and Higher Production Quality

Markus Mink summarizes: “With the new SMT line, we have significantly increased the efficiency of placement at our Weilburg site. The first few weeks of experience with the FUJI systems have shown not only increased output but also lower rejection rates and fewer errors, which significantly reduces downtime on the line.”

For FEIG ELECTRONIC, the new SMT line is a key element in maintaining competitiveness in this demanding market. Its modular design also provides the foundation for future growth – from efficient production to the already planned expansion of production capacities. Its modular design also provides the foundation for future growth – from efficient production to the already planned expansion of production capacities.