FUJI presents placement solutions with WebExpo for electronic panels of 5G-related devices

Close to the customer despite the pandemic – internationally operating specialist for electronic assembly machines provides virtual information about SMT solutions

Kelsterbach, June 30, 2021 – FUJI EUROPE CORPORATION (www.fuji-euro.de) is currently hosting a WebExpo for customers and interested parties. Users can inform themselves virtually about the products and innovations of the internationally active specialist for electronic placement machines. FUJI is thus breaking new ground in order to be close to the customer even in Corona times and to be able to offer appropriate service. The focus of the WebExpo is on solutions for assembly in the manufacture of devices in the field of 5G technology.

The use of 5G technology is picking up speed worldwide. There are more and more application areas. “Commercial 5G services have started to develop digital infrastructure and deploy digital technologies. This brings new potential in industries. Solutions are rapidly emerging, for example, to support new ways of living for individuals, industries and societies. This concerns, for example, maximizing data usage, automated driving and remote operation of robots. At the same time, part placement of electronic panels of 5G-related devices is becoming increasingly difficult due to higher part density and panel complexity,” explains Stefan Janssen, member of the management board of FUJI EUROPE CORPORATION GmbH.

As a result, FUJI has developed new SMT products for manufacturing the electronic panels used in these advanced devices and is presenting them, as well as smart factory solutions with related automation technology and system integration, during its WebExpo. This online presence will present placement solutions for PCBs used in 5G supporting devices, introductions to the latest products and much more.

Among other things, WebExpo attendees can learn about assembly solutions for SIP and module boards. FUJI will demonstrate the introduction of advanced process solutions for components such as SIP and module parts that support 5G terminals and devices. Among other things, WebExpo attendees can learn about assembly solutions for SIP and module boards. FUJI will demonstrate the introduction of advanced process solutions for components such as SIP and module parts that support 5G terminals and devices. During the WebExpo, FUJI will also present automation and digital twin solutions.

Using product videos, FUJI experts will conduct demonstrations of the equipment units and functions. In addition, the “FUJI Smart Factory Members” will be used to illustrate the introduction of M2M solutions.

Stefan Janssen explains, “It is particularly important to us to be able to act close to the customer and provide appropriate service even during the restrictions of the Corona pandemic. At the same time, we are also looking forward to being physically represented at trade shows again starting in the fall.”

Registration for FUJI WebExpo 2021 at:
https://www.fuji.co.jp/en/about/rs/web_expo_2021_pt/?utm_source=gmnewsletter&utm_medium=email&utm_campaign=gmn_about_rs_web_expo_2021_pt_e_210600